GZP2-UG--Thin suction cup with ball guide shaft buffer
It is mainly applicable to the following fields: in the 3C electronics industry, it is used to adsorb smartphone glass cover plates (thickness 0.3-1.1mm) and aluminum middle frame components, and is suitable for the traceless transfer of single/multi-crystalline silicon wafers in the photovoltaic industry.
- Sellingpoint
- Inquiry
- Related Products
